Etchant solutions for the removal of Cu(0) in a supercritical CO2-based "dry" chemical mechanical planarization process for device fabrication

Carol A. Bessel, Ginger M. Denison, Joseph M. DeSimone, James DeYoung, Stephen Gross, Cynthia K. Schauer, Pamela M. Visintin

Research output: Contribution to journalArticle

49 Citations (Scopus)

Abstract

The microelectronics industry is focused on increasing chip complexity, improving the density of electron carriers, and decreasing the dimensions of the interconnects into the sub-0.25 μm regime while maintaining high aspect ratios. Water-based chemical mechanical planarization or polishing (CMP) faces several technical and environmental challenges. Condensed CO2 has significant potential for replacing current CMP solvents as a "dry" etching medium because of its unique properties. In working toward a condensed CO2-based CMP process, we have successfully investigated the oxidation and chelation of solid copper metal in liquid and supercritical CO2 using ethyl peroxydicarbonate and a β-diketone chelating agent.

Original languageEnglish
Pages (from-to)4980-4981
Number of pages2
JournalJournal of the American Chemical Society
Volume125
Issue number17
StatePublished - Apr 30 2003
Externally publishedYes

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Mechanical Phenomena
Cytidine Monophosphate
Chemical mechanical polishing
Chelation
Fabrication
Equipment and Supplies
Dry etching
Microelectronics
Aspect ratio
Chelating Agents
Copper
Oxidation
Electrons
Industry
Liquids
Metals
Water

All Science Journal Classification (ASJC) codes

  • Chemistry(all)

Cite this

Etchant solutions for the removal of Cu(0) in a supercritical CO2-based "dry" chemical mechanical planarization process for device fabrication. / Bessel, Carol A.; Denison, Ginger M.; DeSimone, Joseph M.; DeYoung, James; Gross, Stephen; Schauer, Cynthia K.; Visintin, Pamela M.

In: Journal of the American Chemical Society, Vol. 125, No. 17, 30.04.2003, p. 4980-4981.

Research output: Contribution to journalArticle

Bessel, Carol A. ; Denison, Ginger M. ; DeSimone, Joseph M. ; DeYoung, James ; Gross, Stephen ; Schauer, Cynthia K. ; Visintin, Pamela M. / Etchant solutions for the removal of Cu(0) in a supercritical CO2-based "dry" chemical mechanical planarization process for device fabrication. In: Journal of the American Chemical Society. 2003 ; Vol. 125, No. 17. pp. 4980-4981.
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