Abstract
Nanoscopic ring arrays of various materials show promise for both technological applications and fundamental studies. In this work we report the preparation of sub-50 nm diameter ring arrays from metallic thin films using a block polymer lithographic pattern transfer approach. We prepared a triblock terpolymer that adopts a core-shell cylindrical morphology where the shell is an oxidizable polydimethylsiloxane block. Solvent annealed thin films of this terpolymer produce cylindrical features oriented perpendicular to the substrate surface. The polydimethylsiloxane shell is then converted into SiO x rings by an oxygen reactive ion etch. The resultant hard mask pattern is then transferred into Au, Ni 80Fe 20, and Ni 80Cr 20 thin films via Ar ion beam milling, demonstrating the generality of the approach.
| Original language | English |
|---|---|
| Pages (from-to) | 3550-3557 |
| Number of pages | 8 |
| Journal | ACS Applied Materials and Interfaces |
| Volume | 4 |
| Issue number | 7 |
| DOIs | |
| State | Published - Jul 25 2012 |
| Externally published | Yes |
Fingerprint
All Science Journal Classification (ASJC) codes
- Materials Science(all)
Cite this
Nanoscale rings from silicon-containing triblock terpolymers. / Rodwogin, Marc D.; Baruth, Andrew; Jackson, Elizabeth A.; Leighton, C.; Hillmyer, Marc A.
In: ACS Applied Materials and Interfaces, Vol. 4, No. 7, 25.07.2012, p. 3550-3557.Research output: Contribution to journal › Article
}
TY - JOUR
T1 - Nanoscale rings from silicon-containing triblock terpolymers
AU - Rodwogin, Marc D.
AU - Baruth, Andrew
AU - Jackson, Elizabeth A.
AU - Leighton, C.
AU - Hillmyer, Marc A.
PY - 2012/7/25
Y1 - 2012/7/25
N2 - Nanoscopic ring arrays of various materials show promise for both technological applications and fundamental studies. In this work we report the preparation of sub-50 nm diameter ring arrays from metallic thin films using a block polymer lithographic pattern transfer approach. We prepared a triblock terpolymer that adopts a core-shell cylindrical morphology where the shell is an oxidizable polydimethylsiloxane block. Solvent annealed thin films of this terpolymer produce cylindrical features oriented perpendicular to the substrate surface. The polydimethylsiloxane shell is then converted into SiO x rings by an oxygen reactive ion etch. The resultant hard mask pattern is then transferred into Au, Ni 80Fe 20, and Ni 80Cr 20 thin films via Ar ion beam milling, demonstrating the generality of the approach.
AB - Nanoscopic ring arrays of various materials show promise for both technological applications and fundamental studies. In this work we report the preparation of sub-50 nm diameter ring arrays from metallic thin films using a block polymer lithographic pattern transfer approach. We prepared a triblock terpolymer that adopts a core-shell cylindrical morphology where the shell is an oxidizable polydimethylsiloxane block. Solvent annealed thin films of this terpolymer produce cylindrical features oriented perpendicular to the substrate surface. The polydimethylsiloxane shell is then converted into SiO x rings by an oxygen reactive ion etch. The resultant hard mask pattern is then transferred into Au, Ni 80Fe 20, and Ni 80Cr 20 thin films via Ar ion beam milling, demonstrating the generality of the approach.
UR - http://www.scopus.com/inward/record.url?scp=84864189527&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84864189527&partnerID=8YFLogxK
U2 - 10.1021/am300603x
DO - 10.1021/am300603x
M3 - Article
AN - SCOPUS:84864189527
VL - 4
SP - 3550
EP - 3557
JO - ACS applied materials & interfaces
JF - ACS applied materials & interfaces
SN - 1944-8244
IS - 7
ER -