SEM observation of novel characteristic of the dentin bond interfaces of universal adhesives

Toshiki Takamizawa, Arisa Imai, Eizo Hirokane, Akimasa Tsujimoto, Wayne W. Barkmeier, Robert L. Erickson, Mark A. Latta, Masashi Miyazaki

Research output: Contribution to journalArticle

Abstract

Objective: The aim of this study was to observe the resin/dentin interfaces of universal adhesives by using scanning electron microscopy (SEM), and to compare their morphologies with conventional etch & rinse (ER) and self-etch (SE) adhesive systems. Methods: Two three-step and one two-step ER adhesives and two two-step and two single-step SE adhesives were used for comparison with seven universal adhesives in ER mode and SE mode, respectively. Bonded surfaces with bovine teeth were longitudinally sectioned and mirror-polished. Half of the samples were treated with HCl and NaOCl solutions. The interfaces were subjected to argon ion beam etching and then observed by scanning electron microscopy. Results: The thickness of the adhesive layer (AL) of most of the seven universal adhesives and single-step SE adhesives was similar. Universal adhesives in SE mode formed a hybrid smear layer as a high-density zone between the AL and dentin. The thickness of the hybrid layer (HL) of the universal adhesives in ER mode was ∼1–2 μm, with a high-density zone (reaction layer [RL]) below the HL. Conclusion: The morphological features of most universal adhesives in SE mode and single-step SE adhesives are similar. Although resin–dentin interfaces of universal adhesives in ER mode resemble those of ER adhesives, universal adhesives have a distinctive feature, an RL. Significance: The RL might be a sign of chemical bonding even when using universal adhesives in ER mode.

Original languageEnglish (US)
Pages (from-to)1791-1804
Number of pages14
JournalDental Materials
Volume35
Issue number12
DOIs
StatePublished - Dec 2019

Fingerprint

Dentin
Adhesives
Electron Scanning Microscopy
Observation
Scanning electron microscopy
Smear Layer
Argon
Ion beams

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Dentistry(all)
  • Mechanics of Materials

Cite this

Takamizawa, T., Imai, A., Hirokane, E., Tsujimoto, A., Barkmeier, W. W., Erickson, R. L., ... Miyazaki, M. (2019). SEM observation of novel characteristic of the dentin bond interfaces of universal adhesives. Dental Materials, 35(12), 1791-1804. https://doi.org/10.1016/j.dental.2019.10.006

SEM observation of novel characteristic of the dentin bond interfaces of universal adhesives. / Takamizawa, Toshiki; Imai, Arisa; Hirokane, Eizo; Tsujimoto, Akimasa; Barkmeier, Wayne W.; Erickson, Robert L.; Latta, Mark A.; Miyazaki, Masashi.

In: Dental Materials, Vol. 35, No. 12, 12.2019, p. 1791-1804.

Research output: Contribution to journalArticle

Takamizawa, T, Imai, A, Hirokane, E, Tsujimoto, A, Barkmeier, WW, Erickson, RL, Latta, MA & Miyazaki, M 2019, 'SEM observation of novel characteristic of the dentin bond interfaces of universal adhesives', Dental Materials, vol. 35, no. 12, pp. 1791-1804. https://doi.org/10.1016/j.dental.2019.10.006
Takamizawa, Toshiki ; Imai, Arisa ; Hirokane, Eizo ; Tsujimoto, Akimasa ; Barkmeier, Wayne W. ; Erickson, Robert L. ; Latta, Mark A. ; Miyazaki, Masashi. / SEM observation of novel characteristic of the dentin bond interfaces of universal adhesives. In: Dental Materials. 2019 ; Vol. 35, No. 12. pp. 1791-1804.
@article{5bab2a63a3454594adea9b0180aa3ebb,
title = "SEM observation of novel characteristic of the dentin bond interfaces of universal adhesives",
abstract = "Objective: The aim of this study was to observe the resin/dentin interfaces of universal adhesives by using scanning electron microscopy (SEM), and to compare their morphologies with conventional etch & rinse (ER) and self-etch (SE) adhesive systems. Methods: Two three-step and one two-step ER adhesives and two two-step and two single-step SE adhesives were used for comparison with seven universal adhesives in ER mode and SE mode, respectively. Bonded surfaces with bovine teeth were longitudinally sectioned and mirror-polished. Half of the samples were treated with HCl and NaOCl solutions. The interfaces were subjected to argon ion beam etching and then observed by scanning electron microscopy. Results: The thickness of the adhesive layer (AL) of most of the seven universal adhesives and single-step SE adhesives was similar. Universal adhesives in SE mode formed a hybrid smear layer as a high-density zone between the AL and dentin. The thickness of the hybrid layer (HL) of the universal adhesives in ER mode was ∼1–2 μm, with a high-density zone (reaction layer [RL]) below the HL. Conclusion: The morphological features of most universal adhesives in SE mode and single-step SE adhesives are similar. Although resin–dentin interfaces of universal adhesives in ER mode resemble those of ER adhesives, universal adhesives have a distinctive feature, an RL. Significance: The RL might be a sign of chemical bonding even when using universal adhesives in ER mode.",
author = "Toshiki Takamizawa and Arisa Imai and Eizo Hirokane and Akimasa Tsujimoto and Barkmeier, {Wayne W.} and Erickson, {Robert L.} and Latta, {Mark A.} and Masashi Miyazaki",
year = "2019",
month = "12",
doi = "10.1016/j.dental.2019.10.006",
language = "English (US)",
volume = "35",
pages = "1791--1804",
journal = "Dental Materials",
issn = "0109-5641",
publisher = "Elsevier Science",
number = "12",

}

TY - JOUR

T1 - SEM observation of novel characteristic of the dentin bond interfaces of universal adhesives

AU - Takamizawa, Toshiki

AU - Imai, Arisa

AU - Hirokane, Eizo

AU - Tsujimoto, Akimasa

AU - Barkmeier, Wayne W.

AU - Erickson, Robert L.

AU - Latta, Mark A.

AU - Miyazaki, Masashi

PY - 2019/12

Y1 - 2019/12

N2 - Objective: The aim of this study was to observe the resin/dentin interfaces of universal adhesives by using scanning electron microscopy (SEM), and to compare their morphologies with conventional etch & rinse (ER) and self-etch (SE) adhesive systems. Methods: Two three-step and one two-step ER adhesives and two two-step and two single-step SE adhesives were used for comparison with seven universal adhesives in ER mode and SE mode, respectively. Bonded surfaces with bovine teeth were longitudinally sectioned and mirror-polished. Half of the samples were treated with HCl and NaOCl solutions. The interfaces were subjected to argon ion beam etching and then observed by scanning electron microscopy. Results: The thickness of the adhesive layer (AL) of most of the seven universal adhesives and single-step SE adhesives was similar. Universal adhesives in SE mode formed a hybrid smear layer as a high-density zone between the AL and dentin. The thickness of the hybrid layer (HL) of the universal adhesives in ER mode was ∼1–2 μm, with a high-density zone (reaction layer [RL]) below the HL. Conclusion: The morphological features of most universal adhesives in SE mode and single-step SE adhesives are similar. Although resin–dentin interfaces of universal adhesives in ER mode resemble those of ER adhesives, universal adhesives have a distinctive feature, an RL. Significance: The RL might be a sign of chemical bonding even when using universal adhesives in ER mode.

AB - Objective: The aim of this study was to observe the resin/dentin interfaces of universal adhesives by using scanning electron microscopy (SEM), and to compare their morphologies with conventional etch & rinse (ER) and self-etch (SE) adhesive systems. Methods: Two three-step and one two-step ER adhesives and two two-step and two single-step SE adhesives were used for comparison with seven universal adhesives in ER mode and SE mode, respectively. Bonded surfaces with bovine teeth were longitudinally sectioned and mirror-polished. Half of the samples were treated with HCl and NaOCl solutions. The interfaces were subjected to argon ion beam etching and then observed by scanning electron microscopy. Results: The thickness of the adhesive layer (AL) of most of the seven universal adhesives and single-step SE adhesives was similar. Universal adhesives in SE mode formed a hybrid smear layer as a high-density zone between the AL and dentin. The thickness of the hybrid layer (HL) of the universal adhesives in ER mode was ∼1–2 μm, with a high-density zone (reaction layer [RL]) below the HL. Conclusion: The morphological features of most universal adhesives in SE mode and single-step SE adhesives are similar. Although resin–dentin interfaces of universal adhesives in ER mode resemble those of ER adhesives, universal adhesives have a distinctive feature, an RL. Significance: The RL might be a sign of chemical bonding even when using universal adhesives in ER mode.

UR - http://www.scopus.com/inward/record.url?scp=85075350523&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85075350523&partnerID=8YFLogxK

U2 - 10.1016/j.dental.2019.10.006

DO - 10.1016/j.dental.2019.10.006

M3 - Article

C2 - 31727447

AN - SCOPUS:85075350523

VL - 35

SP - 1791

EP - 1804

JO - Dental Materials

JF - Dental Materials

SN - 0109-5641

IS - 12

ER -